Main Event
Engineering and Technology
San Jose, California, United States
2026-06-01 - 2026-06-04
IITCreg@ieee.org
Event Insights : Gain more knowledge on The 29th edition of the IEEE International Interconnect Technology Conference - for publication and research. The conference seeks papers on all aspects of BEOL/MOL interconnects and metallization, including design, unit process, integration and reliability, as well as how it applies to 2.5D/3D and heterogenous integration. Authors are encouraged to submit their original work describing innovative research and development in the critically important field of on-chip interconnects and heterogeneous integration.
