Conference · Business & Management
London 2026-International Conference on Education and Humanities
International Academic Conferences on Business&Economics, Education and Social Sciences
In short
London 2026-International Conference on Education and Humanities is a conference on business & management taking place in FL, United States, from 13–15 Apr 2027.
About this event
If you would like to present a paper at our 2026 WEI London International Academic Conference, please review these steps:
For abstract proposals, your submissions should include your name, institute affiliation, mailing address, and email address for all authors.
For full papers to appear in our conference proceedings, your manuscript should be saved as a Microsoft Word-compatible file. The text should be formatted for 8.5 x 11-inch paper, single-spaced at 10 points, with one-inch margins and left justified. Your submission should contain the following:
If you can not attend our conference but still wish to have your paper presented, we offer an E-session for your convenience. Your paper will be presented electronically for viewing and discussion using Microsoft PowerPoint with narration (voice-over). More details on preparing this type of presentation can be found here>
However, you are still required to submit a proposal/abstract or full paper, and one author has to pay the registration fee. Your certificate will be e-mailed to you as a pdf, and your paper will also be published in the online conference proceedings.
You are also invited to attend the conference, even if you choose not to present a paper. Remember to select “attending only” when registering for the conference.
Keywords
Quick answers
When is London 2026-International Conference on Education and Humanities?
It takes place from 13–15 Apr 2027.
Where is London 2026-International Conference on Education and Humanities held?
In FL, United States.
Listed by the organizer on 7 Nov 2026. Check dates and fees on the official website before booking travel. Report a problem with this listing.